Compound Semiconductor™ is an Angel Business Communications publication.

A new R&D development designed to support the growth of semiconductor packaging has received a £9 million funding injection, ...

The complicated patent battle between US GaN company Efficient Power Conversion (EPC) and Chinese GaN firm Innoscience ...

GaN specialist Efficient Power Conversion (EPC) has introduced the EPC2367, a next-generation 100 V eGaN FET for power ...

Now, a research team, led by Masato Kotsugi from the Department of Material Science and Technology at Tokyo University of ...

Texas Instruments (TI) has announced new power chips to support the rapidly growing power needs of modern data centres, which ...

Nexperia has introduced a range of industrial grade 1200 V SiC MOSFETs in surface-mount (SMD) top-side cooled packaging ...

The offering of fully decommissioned, ready-to-ship manufacturing assets from Endicott-based Ubiquity Solar—with nearly 600 ...

Mitsubishi Electric Corporation will begin shipping samples of a new 16W-average-power GaN power amplifier module (PAM) for ...

Researchers from Singapore’s Nanyang Technological University and its Agency for Science, Technology and Research are ...

Compound Semiconductor™ is an Angel Business Communications publication.

Innovative companies often have a rich history. Founded by Ernst Leybold in Cologne in 1850, the German vacuum specialist ...