A new technical paper titled “PPAC Driven Multi-die and Multi-technology Floorplanning” was published by Texas A&M University ...

A new technical paper titled “Benchmarking Ultra-Low-Power μNPUs” was published by researchers at Imperial College London and University of Cambridge. Abstract “Efficient on-device neural network (NN) ...

Tariff questions, impact; Europe's chiplets focus; DARPA's quantum push; Intel 18A enters risk production; optical networking ...

A new technical paper titled “Design of Energy-Efficient Cross-coupled Differential Photonic-SRAM (pSRAM) Bitcell for ...

A new technical paper titled “Security Risks and Designs in the Connected Vehicle Ecosystem: In-Vehicle and Edge Platforms” was published by researchers at Università di Pisa, Ford Motor Company, MIT, ...

Deploying GenAI on edge devices offers several compelling advantages, particularly in applications where real-time processing ...

Other markets include a hodgepodge of often ineffective approaches, but changes are coming as the value of connected assets ...

AI chips and data center communications see big funding; 75 startups raise $2 billion. The first quarter of 2025 saw six ...

Distillation makes AI efficient, scalable, and deployable across resource-constrained devices. The rapid advancements in AI ...

The automotive world is experiencing a groundbreaking transformation, with technology and AI-driven innovation at its core.

SE: With all these thermal issues and growing complexity of these multi-die assemblies, are there new kinds of stress testing ...

An architecture that delivers progressively higher levels of functional integration and security can meet a variety of unique ...