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SAN JOSE, Calif. -- April 18, 2024 — Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the new Cadence ® Palladium ® Z3 Emulation and Protium ™ X3 FPGA Prototyping systems, a revolutionary ...
Santa Clara, Calif. - September 2, 2024 — Today SiFive, Inc. announced that it has licensed its SiFive Automotive RISC-V IP cores to Arkmicro Technologies (Shenzhen), accelerating the adoption of RISC ...
As part of this initiative, Analogue Insight and Tetrivis have signed a Memorandum of Understanding (MoU) to jointly develop the chiplet, aligning their IP roadmaps, technology resources, and customer ...
Expedera launches its Origin Evolution NPU IP, bringing hardware acceleration to meet the computational demands of running ...
MILPITAS, Calif. ─ September 4, 2018 ─ The China IC Ecosystem Report, a comprehensive report for the IC manufacturing supply chain, reveals that front-end fab capacity in China will grow to account ...
The ENS92051 is the dual-beam Ku-band receiver (Rx) supporting eight channels with separate amplitude and phase control. The Rx carrier frequency range is 10.7 to 12.75 GHz with an instantaneous ...
The UHT-JPEG2K-E core from Alma Technologies is a very high performance self-contained JPEG 2000 encoder IP core, designed to provide the extreme performance needed by modern image and video ...
Wireless Communications have become an integral part of everyday life, from broadcasting, networking, toys and inventory control to the medical field. Radio frequency (RF) circuits support a wide ...
SINGAPORE -- May, 20 2025 – GlobalFoundries (Nasdaq: GFS) (GF) today announced plans to expand its capabilities in advanced packaging through a new Memorandum of Understanding (MOU) signed with the ...
Paris, Grenoble (France), Malta (USA), Geneva (Switzerland), April 8, 2022 – CEA, Soitec, GlobalFoundries and STMicroelectronics have announced a new collaboration in which they intend to jointly ...
"Native Red Hat Enterprise Linux support on SiFive’s HiFive Premier P550 board offers developers a substantial enterprise-grade toolchain for RISC-V. This is a pivotal step forward in enabling a ...
San Jose, California, May 13, 2024 – NEO Semiconductor, a leading developer of innovative technologies for 3D NAND flash and DRAM memory, today announced a performance boosting Floating Body Cell ...
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